钼铜复合材料研究进展.docVIP

钼铜复合材料研究进展 孙翱魁陈晴柔刘跃军王海军王德志 湖南工业大学包装与材料工程学院西南科技大学材 料科学与工程学院中南大学材料科学与工程学院 钼铜复合材料兼具钼和铜两种金属的优点，具有良好的导电导热性能及真空性 能、较低且可调控的热膨胀系数、较高的高温强度、一定的塑性，且无磁性，故 被广泛应用于电子封装材料、热沉材料、电触头及电极材料、军工及航天领域。 国内外对钼铜复合材料的传统制备方法主要有喷雾干燥法、化学镀法、机械合金 化法、溶胶-凝胶法、化学共沉淀法、粉末注射成型法等；冋吋，研究者还运用了 一些新兴的方法来制备钼铜复合材料，并对制备过程屮涉及的一些理论问题提 出了新的研宂思路。这些研宂存在着一些缺陷，限制了钼铜复合材料的大规模应 用，利用简单、绿色、低能耗的方法制备综合性能优异的钼铜复合材料将是未来 研究的重点。 关键词： 银铜复合材料;性能;应用;制备方法; 孙翱魁(1985 -),男，山东临沂人，湖南工业大学讲师，，主 要从事纳米金属粉末的制备与致密化方面的研宄，E-mail :aksun@hut. edu. cn 2017-03-11 基金：国家自然科学基金资助项目 Research Progress in Molybdenum—Copper Composites SUN Aokui CHEN Qingrou LIU Yuejun WANG Haijun WANG Dezhi School of Packaging and Materials Engineering， Hunan University of Technology; School of Materials Science and Engineering， Southwest University of Science and Technology; School of Materials Science and Engineering，Central South University; Abstract： Mo - Cu composites are of special merits because of excel lent physical, mechanical and electronic properties, such as high thermal and electrical conductivity, low and alterable thermal expansion coefficient, light weight, nonmagnetic, good high - temperature performance and fair plasticity. These properties rendered Mo - Cu composites widespread applications in electronic packing devices， heat sink materials, vacuum technology (electrical contact)，aerospace field and so on. Domestic and international research status of Mo -Cu composites was systematically summarized such as spray drying process, electroless plating, mechanical alloying, sol-gel method, chemical coprecipitation and powder injection forming method, with the latest preparation methods and research approaches emphatically demonstrated based on their development of applications. The defects restricting its large-scale application were detected as well. The development trend and direction of high performance Mo - Cu composites were also prospected based on the limitations of existing researches in order to prepare the well performed Mo -Cu composites by