DS5002 加密芯片介绍.pdf

9/8/2005 PRODUCT RELIABILITY REPORT FOR DS5002, Rev C9 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@ ph: 972-371-3739 fax: 972-371-6016 Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor products: DS5002, Rev C9 In addition, Dallas Semiconductors continuous reliability monitor program ensures that all outgoing product will continue to meet Maxims quality and reliability standards. The current status of the reliability monitor program can be viewed at /TechSupport /dsreliability.html. Device Description: A description of this device can be found in the product data sheet. You can find the product data sheet at /l_datasheet3.cfm. Reliability Derating: The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that are temperature accelerated. AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts AfT = Acceleration factor due to Temperature tu = Time at use temperature (e.g. 55°C) ts = Time at stress temperature (e.g. 125°C) k = Boltzmann’s Constant (8.617 x 10-5 eV/°K) Tu = Temperature at Use (°K) Ts = Temperature at Stress (°K) Ea = Activation Energy (e.g. 0.7 ev) The activation energy of the failure mechanism is deri