微针阵列之研制-德霖.PDFVIP

德霖學報「第二十三期」 民國 98 年 6月 微針陣列之研製 微針陣列之研製 陳育堂 德霖技術學院機械系 摘要 本研究分別利用兩種不同材料並搭配不同的製程技術，設計並完成兩種形貌之微針陣列：高 分子微針陣列和矽質微針陣列，其高度分別為 236 µm和 350 µm 。並評估進行藥物滲透經皮測試， 以瞭解微針陣列對於促進藥物滲透之可行性。 高分子微針陣列係利用矽晶片蝕刻出 V型槽作為模仁材料，再將 SU-8 塗佈於模仁材料上， 並藉由光阻膜厚的製程參數控制，使其得以成功的翻模製作完成 236 µm 之微針。矽質微針陣列 則採用矽晶片做為基材，並使用氫氧化鉀 (KOH)蝕刻液進行非等向性蝕刻，在精準的控制蝕刻時 間且同時利用蝕刻時矽晶片因為側向蝕刻 (undercut)特性產生的快速蝕刻面(Fast-etching planes)之 原理，而成功製作完成 350 µm 之微針。 關鍵字：微針陣列， V型槽， SU-8 ，快速蝕刻面 Fabrication of Microneedles Yu-Tang Chen Department of Mechanical Engineering, De Lin Institute of Technology Abstract This research paper was performed to study and utilizes two kinds of materials which match with two different fabrications in order to design an ideal shape of microneedles. The technology employs the polymer microneedles and the silicon microneedles with the height 236 µm and 350 µm respectively. Moreover, the transdermal drug delivery investigation will be conducted through the experimental results to estimate the feasibility of microneedles. Interestingly, the polymer microneedles utilize molding structure of silicon wafer which uses V-grooves by KOH anisotropic wet etching. The SU-8 negative photo-resist has been introduced for the subject structural material of the microneedles, and utilizies photolithography to take and form a shape. Silicon microneedles utilizes silicon wafer as a substrate to manufacture by KOH etching solution, solely depending on controlled etch time and the principle of Fast-etching planes help to fabricate s