不同镀层结构的金属外壳盐雾试验分析.pdf

37 5 Vol1 37, No. 5 200710 Micr oelectr onics Oct1 2007 黄代会 ( , 400060) : 集成电路外壳的抗盐雾腐蚀能力是由材料冶金电镀工艺及镀层结构等 种因素决定 的对三种底材的三种镀层结构进行抗盐雾对比试验,并对三种结构的失效概率进行了统计分析 结果表明, 在镀层达到一定厚度后,采用镍与金的交叉镀层结构抗盐雾能力最强, 最差的是镍层加 金层结构的镀层外壳 : 集成电路外壳; 金属外壳; 交叉镀层; 抗盐雾 : T N406 : A : 1004-3365(2007)05-0685-04 Analysis of Salt Spray Experiment on Metal Case with Different Coatings HUANG Da-i hui ( Si chuan I nst it ut e of S oli d-S t ate Ci rcui t s, Chi na El ect ronic s T echn ol og y Gr oup Corp . , Chongq i ng 400060, P . R. China) Abstract: Experi ents were conducted on resistance of three coatings to salt spray, and a statistic analysis was ade on failure probability of the three structures. T he result indicated that, for certain thickness of coatings, the etal casewith interleaved nickel and gold coatings has the strongest resistance to salt spray, while the structure of nickel and gold coatings has the weakest resistance. Key words: IC package; Metal case; Interleaved nickel and gold coating; Salt spray resistance EEACC: 0170N 2. 2 1 引 言 , GJB548A 1009A,24 h , :1%, 35 ? 3 e , ,pH 6.5~ 7.2,7.0 psi, 0. 45 L/ h; 80 c 2 , , 1. 0~ 2.0 l , , 2. 3 , , ,, 1 2 试 验 2. 1 Fisher X- Ray ,XDLM-C4PCB 1 , Q-FOG