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Chemical Mechanical Polishing (CMP) Overview[化学机械研磨(CMP)概述](PPT-54)
Outline CMP Basics CMP Process Optimization Environmental Issues in CMP CMP Basics (cont’d) How does CMP work? A rotating wafer is pressed face-down against a rotating polishing pad; an aqueous suspension of abrasive (slurry) is pressed against the face of the wafer by the pad. A combination of chemical and physical effects removes features from the wafer surface. CMP Apparatus Metal Damascene Process Trenches/vias etched into ILD (interlayer dielectric) Metal deposition Metal CMP Repeat for multiple levels of metal Brush Box Double Side Scrubbing (DSS)System Configuration Evaluating Environmental Aspects of Manufacturing The Million Dollar Questions NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Waste Problems Slurry solids present in waste highly basic or acidic solutions cause pH changes in natural waters kills organisms enhances sediment dissolution, diminishes precipitation oxidizers toxic to wildlife Rinse waters large volumes tax wastewater treatment systems water purification wastes are significant (ion exchange wastes, membranes, energy) NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Quantities of Wastes Typical polisher processes 40 wafers/hr. with 65% overall equipment efficiency Aqueous process wastes 190 gallons slurry/day/machine 180 gallons DI rinsewater/day/machine Solid wastes 3-4 monitor wafers/pad for break in (RR drift?) 1-2 pads/machine/day (not including buff pads) Cleaning wastes 190 gallons rinsewater/day/machine cleaning chemicals highly variable NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Subtle Concerns Energy, materials required to manufacture consumables Energy, materials required to manufacture monitor and lost wafers Long and short term environmental impacts Effects of process improvements NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing $1,
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