三维集成电路堆叠硅通孔动态功耗优化董刚武文珊杨银堂.pdf

See discussions, stats, and author profiles for this publication at: /publication Stack-through silicon via dynamic power consumption optimization in three- dimensional integrated circuit Article in Acta Physica Sinica -Chinese Edition- · January 201 DOI: 10.7498/aps.64.026601 CITATIONS READS 0 32 3 authors, including: Yintang Yang Xidian University 583 PUBLICATIONS 1,75 CITATIONS SEE PROFILE Some of the authors of this publication are also working on these related projects: optical wireless communications and novel optical devices View project All content following this page was uploaded by Yintang Yang on 08 July 2016. The user has requested enhancement of the downloaded file. 三维集成电路堆叠硅通孔动态功耗优化 董刚 武文珊 杨银堂 Stack-through silicon via dynamic power consumption optimization in three-dimensional integrated cir- cuit DongGang WuWen-Shan YangYin-Tang 引用信息Citation: ActaPhysicaSinica, ,026601(2015) DOI: 10.7498/aps.64.026601 在线阅读Viewonline: /10.7498/aps.64.026601 当期内容Viewtableofcontents: /CN/Y2015/V64/I2 您可能感兴趣的其他文章 Articlesyou maybeinterestedin 考虑自热效应的互连线功耗优化模型 Anovelinterconnect-optimalpowermodelconsideringself-heating effect 物理学报.2013,62(1): 016601 /10.7498/aps.62.016601 一般边界条件下球形压力容器钢壁中氚和氦-3 的浓度变化规律研究 Research on tritium and helium-3 content distributions in steel wall of spherical pressure vessel under generalboundarycondition 物理学报.2012,61(15): 156601 /10.7498/aps.61.156601 金属互连电迁移噪声的非高斯性模型研究 Non-Gaussiananalysisofnoiseformetalinterconnection electromigration 物理学报.2012,61(20): 206601 /10.7498/aps.61.206601 fcc 金属表面能的各向异性分析及表面偏析的预测 Anisotropyanalysisofsurfaceenergyandpredictionof surface segregation for fccmetals 物理学报.2011,60(1): 016601 /10.7498/aps.60.016601 物理 学报 Acta Phys. Sin. Vol.