LED封装胶的制备及其性能的研究.docx

LED 封装胶的制备及其性能的研究*崔宝军，陈维君，李刚，宋军军，耿庆生，梁泰硕，王文博（黑龙江省科学院石油化学研究院，黑龙江 哈尔滨 150040）摘要：研究合成了甲基苯基乙烯基有机硅树脂、甲基苯基氢基有机硅交联剂、配位铂催化剂，再通过优化组合，制备出高透明、高折光率 LED 封装用有机硅胶黏剂，确定封装胶的凝胶温度 100℃、固化温度 110.9℃和后处理温度 142.2℃，固化反应热△H 为 -7.74J/g。讨论了树脂、交联剂、催化剂配比对封装胶力学性能影响。分别研究了 80℃、120℃、150℃下封装胶的固化状 态，发现封装胶的力学特点是低温下剪切强度不高，高温强度不低。所制备的封装胶热稳定性高，通过 TG 分析，失重拐点在260℃左右；封装胶的光学性能优异，其透光率为 98%、折光率为 1.51。关键词：甲基苯基乙烯基有机硅树脂；甲基苯基氢基有机硅交联剂；配位铂催化剂；有机硅封装胶；透光率；折光率中图分类号：TQ 433.438文献标识码：A文章编号：1001-0017（2014）05-0318-05Study on the Preparation and Properties of Encapsulating Adhesive for LEDCUI Bao-jun, CHEN Wei-jun, LI Gang, SONG Jun-jun, GENG Qing-sheng, LIANG Tai-shuo and WANG Wen-bo（Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, China）Abstract: The methyl phenyl vinyl silicone resin, hydrogen methyl phenyl silicone cross-linking agent and platinum coordination catalyst were synthesized respectively, and then the organic silicone encapsulating adhesive was prepared by optimizing the combination. The gelation temperature of the adhesive was 100℃, the curing temperature was 110.9℃, the post-curing temperature was 142.2℃ and the enthalpy of curing reaction △H is -7.74J/g. The effect of proportion of resin, cross linking agent and catalysts on the mechanical strength of this adhesive was discussed. The cured states of the encapsulating adhesive cured at 80℃, 120℃ and 150 ℃ were researched respectively. And it was found that the mechanical characteristic of this adhesive was that the shear strength was not high at low temperature, but it was not low at high temperature. The encapsulating adhesive had good thermal stability, its weight loss inflection point was 260℃ approximately. The optical property of the encapsulating adhesive was excellent, its trans － mittance was 98% and the refractive index was 1.51.Key words: Methyl phenyl vinyl silicone resin; hydrogen methyl phenyl silicone cross-linking agent; platinum coordination catalyst; organic sili －cone encapsulating adhesive;