英特尔半导体（大连）有限公司介绍.doc

英特尔半导体（大连）有限公司介绍 2007 年 3 月 26 日，英特尔宣布投资 25 亿美元在大连市建设 300 毫米（12 英寸）芯片制造工厂。该工厂是英特尔在亚洲的第一个晶圆厂进一步体现了英特尔对中国的承诺和深入推进本地化的决心，同时也是公司在中国长期投资的延续。秉承与中国共成长的战略，该项目将带动辽宁乃至整个老东北工业基地的经济发展，有助于本土信息技术产业形成集群效应，使产业链延伸至更广阔的市场区域。 F68 Process Engineer Working Location: Dalian Responsibilities and Details In this position, you will be reporting to Process Engineering Manager and working closely with process engineering, yield/integration and manufacturing teams to start up and ramp the 1st Intel 300 mm Fab in Asia and will be located in Dalian. Applying to this posting will allow you to be considered for all process engineer positions available at this time. Your responsibilities will include but not be limited to: Leading and owning process and equipment qualification, tool preventative maintenance, management of troubleshooting activities, regular monitoring of tool/process performance, defect analysis/reduction and cost reduction to achieve both operation and equipment excellence under LEAN principle. Working with existing Intel 300mm Fabs around the world to improve tool and process performance, reduce cost, and increase flexibility in process transfer. Working and leading manufacturing equipment teams to develop inventive solutions to improve execution and efficiency in a high-volume manufacturing environment Specific function areas/toolsets Litho scanner, track, process integration and litho metrology. Diffusion, implant, RTA, CVD, PVD, Cu plating, CMP, Thin Film Metrology, defect metrology equipment, and wafer handling equipment. Wet clean/etch and plasma etch/ash. Qualifications Candidate must be on track to obtain a BS/MS/Ph.D degree, by 2010, in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, and Chemistry or in the related fields, with good skills in MS office and related software applications. Candidates should have good communication skills in Chinese and have passed CET6 test. Candidates should be able to provide some pr