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Lecture 5Putting It All Together:Modeling Package Families I Key Package Families So far, we have: understood basic packaging concepts learnt about some common packaging materials tried to understand packaging by focusing on the various elements of a package; i.e. its “molecules” Now it is time to put together the molecules to form real substances - the packages themselves! Key Package Families Common packages: Plastic PQFP/TQFP PowerQuad/PowerPQFP SOP/TSOP PBGA TBGA Micro-BGATM PPGA DIP PLCC TO Key Package Families Common packages: Ceramics: CPGA CBGA CQFP The packages we will examine are the most important in terms of volume of use and/or thermal criticality PQFP Plastic Quad Flat Pack (thin version called TQFP) Very popular family for logic chips, ASICS, graphics chips, etc. Peripheral leaded, surface mount PQFP Typical cross-section (not to scale): PQFP PQFP Advantages: Mature package, uses traditional plastic and wire bonding manufacturing techniques Low cost Ideal for low / medium power parts with medium level I/O count (~ 50 - 300) Disadvantages: High thermal resistance, power rarely exceeds 2 W Needs thermal enhancements (slugs etc.) for higher powers Peripheral I/O’s, pitch difficult to reduce below ~0.5 mm: low I/O density Co-planarity problems PQFP Modeling tips: Model elements (die, leadframe etc.) as explained before Key thermal paths (without heatsink) are: die - die flag - leadframe - board PQFP Modeling tips: Additional thermal paths with heatsink present PBGA Plastic Ball Grid Array Pioneered by Motorola in the late 1980’s Area array, surface mount package PBGA What makes a package a PBGA? Organic substrate Solder balls for 2nd level interconnect Applications: ASIC’s, memory chips, graphics chips PBGA PBGA: Wire bonded Cavity-up PBGA Wire-bonded Cavity-down PBGA Flip-chip Emerging package style PBGA PBGA’s are rapidly becoming popular because: Area array package with small pitch: high I/O density BT has good electrical properties Manufacturi