WLAN芯片技术应用与整合.pptVIP

* June, 17, 2010 WLAN芯片技術應用與整合 WLAN Application and Integration Ralink Confidential - - - WLAN,?xDSL?CPE,?Ethernet,?SoC,?Bluetooth Publicly?traded?(TAIEX?3534,?Ralink) Over?600?employees 2009年财务概况 2009?Financial?Results - - - Shipped?52.7M?WLAN chipsets,?YoY?+41.7% Shipped?20M?ADSL2+?chipsets,?YoY?+88.6% Combined?Revenue?of?US$221.6?million 全球分公司据点 Global?Offices - Taiwan,?China,?Japan,?United?States,?Europe 分布各行业之客户 Diversified?Customer?Base - 雷凌企业概况 Ralink?Overview 世界级的通信技术 World‐Class?Communications?Technologies Broadband?Carrier,?PC?OEM,?Retail,?Consumer?Electronics Ralink Headquarters - Hsinchu, Taiwan - RALINK PROPRIETARY CONFIDENTIAL- 2 售市场份额 Ralink?is? 通信产品之领军者 Product?Leadership 2010 预计成长40% Ralink?expects?shipment?volumes?to?grow?more?than?40%?YoY?in?2010 15% 全球市场份额 Ralink??is?with?12%?global?market?share?for? WLAN?chips?in?2009?and?will?reach?15%?in?2010 #2 xDSL全球市场份额 Ralink?is?on?track?to?be?the?#2?global?xDSL? CPE?chip?supplier?in?2010 #1 WLAN全球零Ralink Confidentialthe?#1?WLAN chipset? supplier?in?the?Retail?and?Broadband?segments 2009?Segment?Mix 2009?Product?Mix - RALINK PROPRIETARY CONFIDENTIAL- 3 Wi‐Fi 72% xDSL 28% Retail 38% Broadband 47% PC?OEM 12% CE 4% WLAN技术之领导者 Technology?Leadership 产品创新 Product?Innovation ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ ‐ 1st Single?Chip?802.11n?1x1?PCIe?? MiniCards 1st Single?Chip?Router?with?802.11n?+?CPU?+?10/100?switch 1st 802.11n?MediaConnect?chips?for?consumer?electronics 1st 450?Mbps?3x3?Solution?with?Transmit?Beam?Forming 1st xDSL?solution?designed?onto?a?2‐layer?board 1st xDSL?plus?WLAN combo?solution?with?a?2MB?Flash and?8MB?SDRAM?memory?footprint Ralink Confidential 业界技術领先地位 Industry?Leadership Products?included?in?various?WFA?802.11n?test?beds Membership?of?WAPI?Alliance Vice?Chair?of?Wi‐Fi?Alliance?Technical?Workgroup Active?participation?in?IEEE802.11?task?groups Active?participation?in?CCSA 400?patents?issued/pending?for?802.11?and?xDSL?chips,? algorithms,?software,?ha