电阻分析仪在球格阵列构装研发上的应用-德霖.PDFVIP

列 年六 列 立料 ULSI 領IC (gate) 聯RC(RC-delay) 聯 料不論 (flip chip, FC)(solder bump) 列(ball grid array, BGA) 路 路 都 數 益 度聯串 來易 了 連路 (daisy chain) 金// 串 來 利量 列串 了 不 參數不度 金// (1)金 (2)金 (3) (electron migration) Kirkendall 洞 (4) 料數 (Coefficient of Thermal Expansion, CTE)不 冷 裂(5) 都 路 度 DC I-V 列 度 The Application Research of Resistance Instrument on the Ball Grid Array Packages * * ** Tien-tsai Chang , Shiuan-Sheng Wang , Tung-Han Chuang * Department of Mechanical Engineering, De Lin Institute of Technology ** Department of Materials Science and Engineering, National Taiwan University Abstract Advancing the manufacturing technologies of ULSI into a deep submicron field, the performance of ICs was increased by shrinking from gate size. Nevertheless, the system performance of the electrical products is possibly retarded by the electrical packaging RC-delay of j oints and interconnect. Although the materials of FC solder bump, BGA solder ball, and interconnect have lower resistance coefficient, nowadays by decreasing the line width and the increasing the aggregate element, the collude resistance of the jo ints and interconnect was easily affected by the reaction of interface. This study surely contributes the circuit of daisy chain to measure various electrical resistance of a precision DC I-V electrical resistance instrument. The different manufacturing mechanism and