A DOE Set for Normalization-Based Extraction of Fill ：美国能源部设定为基础的标准化的填充提取.ppt

05/19/2006 Rasit Topaloglu / LTD-CMC A DOE Set for Normalization-Based Extraction ofFill Impact on Capacitances Motivation Introduction Industy Needs to Incorporate the Impact of Fills Previous Work Motivation Proposed Normalization-Based Flow Fill DOE Used in the Proposed Flow Proposed DOE Structure Basic DOE Algorithm Incorporation of Inter-Layer Coupling Experimental Results and Analyses Based on Fill DOE Summary, Conclusions and Acknowledgments TODO LISTCMPkeepoff rulepatent referencecompact modeling for prev. work Introduction In order to reduce the metal height variations within a die, (dummy, CMP) fills are added to the layout of metal layers. Addition of fills can be either handled by the design house, mask house, or the foundry. As fills are inserted to reduce the thickness variations caused by chemical-mechanical polishing, ideally, they should not alter the capacitances of and between interconnects. Although design rules help reduce the increase in capacitances, these rules are not sufficient to eliminate the impact of fills on capacitances: for inter-layer second neighboring layer coupling : no design rule available! for inter-layer first neighboring layer coupling : no design rule available! for intra-layer coupling : keep-off design rule used Industry Needs to Incorporate the Impact of Fills Accurate analysis of fill impact on capacitances Design of experiments to compare different Fill types Staggered Two-pass Traditional Stack parameters Metal height Multiple inter-layer dielectric stacks Different dielectric constants and heights Design parameters Fill width Fill to fill spacing Keep-off distance Metal width Metal orientations Previous Work Graph node reduction-based methods Estimates voltage on floating fills by interpolating neighboring interconnect voltages Assuming charge on a floating fill as 0, computes all the coupling capacitances Reduces capacitances through graph node updates such that there is no coupling capacitance between a