形状记忆环氧树脂及其复合材料的制备与性能研究-高分子化学与物理专业论文.docx

形状记忆环氧树脂及其复合材料的制备与性能研究-高分子化学与物理专业论文.docx

形状记忆环氧树脂及其复合材料的制备与性能研究-高分子化学与物理专业论文

广东工业大学硕士学位论文提高复合材料的力学强度,且由于碳纤维阻碍链段运动导致体系形状记忆性能也有 所下降:单向碳纤维布能有效的提高形状记忆环氧树脂的力学性能、形状回复率、 形状回复速率,但形状固定率有所下降。关键词:形状记忆聚合物;环氧树脂;二次固化;固化动力学:碳纤维II万方数据ABSTRACTABSTRACTAs a new intelligent material,shape memory polymer has a great application prospect in Aerospace,biomedical,home dress,etc.In this paper,latent curing agent was added into shape memory epoxy(SMEP)to realize secondary curing technology,whichto improve the heat resistance and mechanical properties of SMEE The curing kinetics ofvarious resin systems were studied by non-isothermal DSC method.In addition,the PPGDGE was added to enhance the poor toughness of SMEP,and the carbon fiber to improve mechanical properties.The purpose of this research was preparing shape memory epoxy with high mechanical properties and excellent shape memory properties.The different curing degree SMEP were prepared.Variation of storage modulus andloss factor along with temperature for the resin systems were determined by dynamic mechanics analysis(DMA).The CROSS—linking degree of resin systems were calculated and the condition of shape memory properties existing was analyzed.The cross-linking degree and deformation recovery temperature,which influence on shape memoryproperties and deformation recovery time were studied,respectively.The influence ofshape deform cycle—index on the shape memory properties and mechanical properties were discussed.The resuRs showed that when the curing degree of SMEP was 70%,theSMEP could recovery to its original shape in 1 0 1 s,its shape fixed ratio and shape recovery ratio were above 95%.the number of valid folding of the SMEP was 20.The secondary curing was realized by adding high temperature latent curing agentinto SMEP.The curing peak temperature of shape memory epoxy resin systems were tested by DSC,results showed that a new exothermic peak was found in epoxy resin system with latent curing agent,the two peaks deviate was more than 1 05℃,which showed that the secondary curing technology had feasibil

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