倒装焊与芯片级封装技术研究.pptVIP

倒裝焊与晶片級封裝技術的研究 * Why Flip Chip? Better manufacturing yield than wirebond for high pin-count chips. 對于高密度引腳芯片，成品率优于丝键合。 Faster manufacturing through-put than wirebond for high pin-count chips. 對于高密度引腳芯片，生产效率高于丝键合。 More reliability than wirebonded chips. 可靠性优于丝键合封装芯片。 Better electrical characteristics (less inductance) for high-speed chips. A must for RF, optoelectronics, high-speed digital (500MHz). 对于高速芯片，具有良好的电学性能。 * More on Why Flip Chip? Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊点阵列封装需要倒装焊。 Desirable for Chip Size Package (CSP). 芯片尺寸封装技术需要倒装焊。 The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%. 倒装焊晶片市场预计年增长37%，而整体IC增长仅8%。 The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers. 倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。 * Forecast on IC Unit IC产量预测(2000-2005) Units (Billion) Year Source: Electronic Trend Publications Inc, 2001 Compound Annual Growth Rate: 8.3% 来自中国最大的资料库下载 * DQ Forecast Bare Die Usage(1999-2004) (Units in Million) Source: Dataquest, April 2001 * Forecast on Bumped Wafers Usage凸点晶片使用预测 (2000-2005) 26.2 20 14.8 10.4 6.86 3.4 No. of Bumped Wafers 2005 2004 2003 2002 2001 2000 Year Source: Dataquest, April 2001 (Units in Million) * Technology Leaders are Sold on Flip Chip倒装焊在技术领先企业中的应用 Intel has migrated completely to flip chip bonded BGA for the Pentium 4 product family due to high clock speed and high pin-count (4000). 鉴于高速和高引脚(4000)要求，Intel已在奔腾4产品系列中完全采用倒装焊键合的BGA技术。 The most advanced opto-electronics components from NTT uses flip-chip technology exclusively. 来自NTT的最新光电器件也使用了倒装焊技术 。 IBM has used flip-chip 30 years. 倒装焊技术已在IBM使用了超过30年 * Low Risk and Established Infrastructure低风险和建厂基础 Well established industrial infrastructure. 良好的建厂工业基础 Production equipment similar to chip and printer circuit board industries. 生产设备与芯片和印刷电路板工业相近 Compatible to Surface Mount Technology (SMT). 与表面贴装技术兼