特种模块封装工艺研究-电子与通信工程专业论文.docx

ABSTRACTABSTRACTTherelationsofdevelopingaboutmodernPackagingtechnologyandtheadvance of reliabilityfor electronequipment would be more and moreosculation，Theimport ofmodernPackagingtechnologyinnationalandinternationalbecomeincreasingly prominence.Thestudyforsealtechnicapplytothematerialwithhigh thermoconductivitybeprovidedwiththepracticaldemands,andhavesometechnology challengeand original. Also solved the common technologyproblem in the product with the same structure.Thestudyindesignofwaveguidewindowmainlysolvedbatchproductionand secrecyissue.Thedesignofsealjointtechnologyapplyinginhighthermoconductivity material,whichcansolvethereliabilityandstabilizationproblemofbaredie,content therequirement ofmodern electronequipmentforstabilizationand reliability.Therefore ithasall-importmentsignificanceforthefurtherstudyintheproductpackingcommon technologyAccordingtotheidiographicdemandofsomemodule,thepapergroped technologyofthedesignofwaveguidewindowandpacking,materialwithhigh thermoconductivity,completedthestudyofthesealjointinwaveguidewindowandin modulesealjointcomponents,settledthepuzzleinproduction,thetechnologytarget attained GJB548A-96 provisions.Thejob and theinnovation ofthis paper is:1．Analysedthemechanismofwaveguidepinholecoupling,foundseveralwaysin window design.2．preferentialselect thetechnologyforhigh precision window process byexperiment.3．foundthe ways in airproof packingwindow metaloxidation4．researched thesolder reliabilityofglass and metal, completed the research of window airproof sodering.5．Completedthestudyofthemoduleairproofbymoduleairproofexperiment,gotthesatisfyingresult.ABSTRACTKey words:Design of waveguide window , Minutelymolding forKavor, Seal jointin material with high thermal conductivity。目录目录第一章绪论11.1论文研究的背景11.1.1特种产品封装的进展11.1.2集成电路的发展与封装41.1.3特种模块封装的结构和发展趋势51.2论文研究现状及论文主要工作81.2.1论文研究现状81.2.2论文选题和主要研究内容10第二章波导窗口的设计与制造研究132.1波导窗口设计132.1.1国外窗口设计132.1.2本所窗口设计152.2窗口制造研究182.2.1窗口加工制造研究182.3低膨胀合金的退火处理322.4窗口基体金属氧化研究352.4.1金属与玻璃封接的机理362.5金属氧化的热力学和动力学3