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HER GPP Wafer Cross-Section Dice View Dice Back side Lateral view Cross Section HER GPP Dice 50mil Spec. HER GPP Dice 50mil Dimension HER GPP Dice 50mil Dimension HER GPP Dice 60mil Spec. HER GPP Dice 60mil Dimension HER GPP Dice 60mil Dimension HER GPP Dice 82mil Spec. HER GPP Dice 82mil Dimension HER GPP Dice 82mil Dimension HER GPP Front Metal EDS HER GPP Back Metal EDS * (For solder) Ni/Ni/Au Top Metal Ni/Ni/Au Back Metal (For solder) Metallization 152±20 Scribe line width 660±15 Top metal pad size (C) 1270±15 Chip size (B) 320±15 Wafer thickness (A) um Item N+ C A P+ N B Top Metal Pad size 553um Chip size 1275um EGF1D Lot No:E50200A-840025 Scribe Line width 143um EGF1D Lot No:E50200A-840025 (For solder) Ni/Ni/Au Top Metal Ni/Ni/Au Back Metal (For solder) Metallization 152±20 Scribe line width 914±15 Top metal pad size (C) 1524±15 Chip size (B) 320±15 Wafer thickness (A) um Item N+ C A P+ N B Top Metal Pad size 911um Chip size 1529um EGP20A Lot No:E60200B-8A0210 Scribe Line width 141um EGP20A Lot No:E60200B-8A0210 (For solder) Ni/Ni/Au Top Metal Ni/Ni/Au Back Metal (For solder) Metallization 152±20 Scribe line width 1473±15 Top metal pad size (C) 2082±15 Chip size (B) 320±15 Wafer thickness (A) um Item N+ C A P+ N B Top Metal Pad size 1467um Chip size 2087um EGP30J Lot no:E82600A-8B0206 Scribe Line width 148um EGP30J Lot no:E82600A-8B0206 100.00 Totals 134.61 103.81 Au M 0.01 0.00 Ni K -34.62 -3.81 Si K Atomic% Weight% Element *
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