微电子封装提纲.docVIP

微电子封装技术 Chapter 1 Introduction 第1章 简介 1.The development characteristics and trends of microelectronics packaging. 微电子封装的发展特点和趋势。 2. The func tions of microelectronics packaging.。 3. The levels of microelectronics packaging technology. 微电子封装技术水平。 4. The methods for chip bonding. Chapter 2 Chip interconnection technology 第2章 芯片互连技术 It is one of the key chapters 它是一个关键的章节 1.The Three kinds of chip interconnection, and their characteristics and applications.。 2.The types of wire bonding (WB) technology, their characteristics and working principles. 。 3.The working principle and main proces