基于时域频域特征分析的倒装芯片缺陷检测分析-detection and analysis of flip-chip defects based on time-domain and frequency-domain feature analysis.docxVIP

AbstractThe flip chip package, with its small size, high I/O density, excellent electrical properties, and high reliability, has become the mainstream technology in microelectronics packaging industry. However, internal defects of flip chip package happen easily because of high packing density and thermal expansion coefficient mismatch of chip and substrate. Now the inspection of solder bumps has been an important process in the electronics manufacturing industry to reduce cost and ensure product quality and reliability. The primary works of the dissertation include:Firstly, the vibration model of flip chip was deduced and the principle of defects inspection base on characteristic features of vibration signals in time and frequency domain was presented. An experimental system for solder bump inspection was constructed, in which FC was excited with air-coupled ultrasound, and then the vibration signal was measured by a laser vibrometer.Secondly, an inspection method of flip chips with arrayed solder bumps was proposed, based on natural frequencies. The influence of defects on the natural frequencies was described. The natural frequencies of flip chips were calculated, simulated and measured in the experiments. The results validates that the natural frequencies of defective chips were smaller than the ones of non-defective chips. The sensitive degree of natural frequency among different modes was not equal. The mode shapes were obtained to disclose the differences of frequency shifts in different modes.At last, for flip chip with peripheral solder bumps, an inspection base on characteristic features of vibration signals in time and frequency domain was presented. The coefficients in time domain and the energy features in frequency domain were extracted for fault diagnosis. Then the features were normalized and fed to the BP neural network for classification and recognition. The results showed the relative importance of signal features in the inspection of flip chi