tan薄膜材料及微波功率薄膜电阻器分析-analysis of tan thin film materials and microwave power thin film resistors.docxVIP
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tan薄膜材料及微波功率薄膜电阻器分析-analysis of tan thin film materials and microwave power thin film resistors
摘要率薄膜电阻器的结构和性能,获得了四个电阻器的结构与尺寸,且每个电阻器在各自频率范围内的驻波比均小于1.2。在TaN微波功率薄膜电阻器制备和测试方面,根据设计仿真结果,采用反应直流磁控溅射技术和掩膜图形化技术制备了系列TaN微波功率薄膜电阻器,所制备的系列微波功率薄膜电阻器的TCR绝对值均小于100ppm/℃,在满功率测试期间电阻器表面温度均在120℃以下,在功率负载测试前后电阻器阻值变化均在3%以内,在设计的频率范围内微波功率薄膜电阻器的电压驻波比均小于1.2,测试结果与设计结果相一致。关键词:TaN薄膜,微波功率薄膜电阻器,电阻温度系数,驻波比ABSTRACTABSTRACTMicrowavepowerthinfilmresistorswerewidelyusedasanimportantcomponentofRFandmicrowavesysteminradar,communications,electroncountermeasureetal.Inthisthesis,firstly,TaNfilmswerepreparedbyDCreactionmagnetronsputtering.TheinfluencesofN2partialflow,filmthickness,AldopingandTaN/Almultilayeronthemicro-structureandtheelectricpropertieswereinvestigated.Secondly,theequivalentcircuitmodelwasestablishedbasedonlossytransmissionlinetheory,andthedimensionsandcharacteristicsweredesignedandsimulatedbyHFSSsoftware.Atlast,TaNmicrowavepowerthinfilmresistorswerepreparedbyDCreactionmagnetronsputteringandpatterntechnologyaccordingtothesimulationresults.Themainresultsareasfollows.IntheaspectofTaNthinfilms,theresultsshowthattheresistivityandabsoluteTCRoftheTaNfilmsgoupgraduallywiththeincreaseofthenitrogenpartialflux.Withincreaseofthenitrogenpartialfluxfrom2%to6%,theresistivityofthesamplesareincreasedfrom344μΩ·cmto1030μΩ·cm,andtheabsoluteTCRofthesampleareincreasedfrom30ppm/℃to750ppm/℃.However,themaincrystallinephasesexistingintheTaNfilmsareTa2Nwhennitrogenpartialfluxislessthan5%,whichcouldleadtolowerabsoluteTCR.ThemaincrystallinephasesexistingintheTaNfilmsareTaNandTa3N5whennitrogenpartialfluxislargerthan5%,whichpossesshigherabsoluteTCR.TheelectricalpropertiesofTaNfilmsaresignificantlyaffectedbythethicknessoffilms.TheresistivityandabsoluteTCRoftheTaNfilmsaredecreasedslowlywiththeincreaseofthethicknessofTaNfilms.Whenthethicknessoffilmsareincreasedfrom30nmto280nm,theresistivityofthesamplesaredeclinedfrom519μ?·cmto210μ?·cm,andtheabsoluteTCRofthatarealsodescendedfrom150ppm/℃to30ppm/℃.FortheTaNthinfilmwithdopingAl,theresistivityandabsoluteTCRoftheTaNfilmsareincreasedmoderatelywiththeratiosoftheAl/Taarea.Whenther
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