ir_bonding__介绍.pptVIP

WIRE BOND PROCESS INTRODUCTION CONTENTS 封裝簡介 封裝流程 Wafer Grinding Wire Bond 原理 B.PRINCIPLE 銲接條件 Bond Head ASSY X Y Table W/H ASSY Eagle Eagle Eagle Bonding Process The Wire Bond Temp Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Free air ball is captured in the chamfer Formation of a first bond Formation of a first bond Formation of a first bondContact Formation of a first bondBase