红外测温系统的设计—毕业设计.docVIP

安徽工业大学 毕业论文摘要到目前位置，我国的温度测量仪器仍然是以水银温度计为主，这种测量仪器存在很多缺点，如精度低，测量时间长，不安全等。本课题所研究的红外测温系统能实现人体温度的近距离或远距离准确测量。该设计以STC89C52单片机为核心部件。利用非接触式温度传感器OTP-538U对温度进行采样。得到的电信号经过四运算放大器芯片LM324前置放大后送至A/D模块，A/D采用12位高精度的TLC2543芯片，数字信号传送到主控芯片STC89C52，并由微处理器完成数据采集和转换，实现温度的实时测量 并实时显示在LCD1602模块上。本文所研究的非接触传感器单片机测温系统由于对被测物体的红外辐射进行的是非接触无损测量，测量过程中不会扰乱被测部分的温度场，响应快，温度分辨率高，稳定性好和使用寿命长等一系列的优点，比传统的接触式测温有更多的场合适应性。关键词：STC89C52；非接触传感器；LM324；红外辐射ABSTRACTSo far ,our country’s temperature measuring instrument is still a mercury thermometer mainly. This kind of measuring instrument has many shortcoming,such as low accuracy.measuring time long,unrest congfigruent.The subject of the infrared temperature system can realize the body temperature close distanceor distance measured accurately.The design for the STC89C52 single-chip microcomputer as the core component. Use contact-less temperature preach OTP-538U temperature in sampling.Operational amplifier chip LM324 will sent electrical signals to the A/D module after pre-amplification,A/D and 12 of the high accuracy of TLC2543 chip,digital signals to control STC89C52core,and the microprocessor complete data collection and conversion,realize real-time temperature measurement and real –time display to LCD1602 module.This paper studies the contact signal-chip microcomputer temperature measurement system because of the object to be tested for infrared radiation is the contact nondestructive measurement, the measurement process won’t disrupt the measured part of the temperature field,fast response,temperature high resolution,good stability and long service life and a series of asvantages,than traditional contact temperature measurement have more situations adaptability.KEY WORDS : STC89C52；Non contact sensor；LM324；Infrared radiation目 录 TOC \o 1-3 \h \z \u HYPERLINK \l _Toc359444623 第1章 绪论 PAGEREF _Toc359444623 \h 1 HYPERLINK \l _Toc359444624 研究课题背景 PAGEREF _Toc359444624 \h 1 HYPERLINK \l _Toc359444625 第2章 红外