测温板制作PorfilerboardPorfiling.pptVIP

Profiler board Profiling Date: 2002.05.12 Rev. No.: 01 Approved By : Prepared By : Xiaoping.chen 1. Scope : 范围: This program applies for Temperature Profiling for all product in Flextronics Industrial (zhu hai). 适合伟创力实业有限公司所有产品温度曲线的制作. Date: 2002.05.12 Rev. No.: 01 2.Instrument: 仪器及工具 high temperature glue paper high temperature solder DATAPAQ9000 thermocouple Date: 2002.05.12 Rev. No.: 01 3. Thermocouple preparation 准备热电偶线 3.1 Only “K” type thermocouple wire be used for temperature profiling . 做温度曲线只能使用＂Ｋ＂型热电偶线． Date: 2002.05.12 Rev. No.: 01 3. Thermocouple preparation 准备热电偶线 3.2 Ensure thermocouple wire is minimum 15cm extension from board edge . 确定热电偶线从板边延长最少15cm． Date: 2002.05.12 Rev. No.: 01 15cm 4. preparation of profiling board 准备温度曲线测试板 4.1 Get ready the board for temperature profiling , select the actual product or approximate product as the sample board . 用生产产品的板或者近似生产产品的板做为温度曲线的 测试样板 4.2 Identify the locations for soldering thermocouple wires. 确定焊接热电偶线的位置． Date: 2002.05.12 Rev. No.: 01 A) A minimum of three points must be measured on a PCB. The three points to be measured are the lead , end and center of the SMD component . 一块板上最少有三个测试点，这三个点分别在板面上前， 后及中间的ＳＭＤ元件． 4. preparation of profiling board 准备温度曲线测试板 Date: 2002.05.12 Rev. No.: 01 B) The selection will be based on the coldest and the hottest location on the PCB . 在ＰＣＢ上选择最冷的及最热的位置． 1) The coldest will be the most massive component and in the most densely loaded area 最冷的位置在最大的元件和元件最密集的区域． 2) The hottest will be the highly exposed or isolated area 最热的位置在非常曝露或者单独一个的区域． 4. preparation of profiling board 准备温度曲线测试板 Date: 2002.05.12 Rev. N