Low Alpha Materials and Metrology in the IC Industry知识讲稿.ppt

* LBCF Workshop Clark Wilkinson, 2005 Low Alpha Materials and Metrology in the IC Industry Current Status and Future Requirements /sundae_meng IC Materials Overview High purity metals and alloys Cu, Al, Ta, W, Ti, Pb, Sn, Ag, Ru Range in purity from 99.99% to 99.9999% Alpha Activity Requirements 0.02 ??hr?1?cm?2 : early 1990’s 0.01 ??hr?1?cm?2 : late 1990’s 0.002 ??hr?1?cm?2: 2001 0.0002 ??hr?1?cm?2:2006 Primary alpha emitters 210Pb in Pb/Sn solders U Th Material purity critical to reliability Current Material Challenges: Contamination Any material with U and/or Th above 1 ppb Some 99.99% materials fail Sn, In Possible contaminants Refractory materials and ceramics Abrasives Atmospheric dust and debris Commercial metals alloys All stages of manufacturing processing must be controlled monitored Assume any material is an alpha contamination hazard until proven otherwise Current Instrumentation Capability Industry uses Gas Proportional Counters Area :1000 cm2 Geometry: 2? Background 2-3 cph optimal, 4-6 nominal No energy spectroscopy capability Limited ability to identify contamination sources 0.002 analysis requires ~7 days counting time for 20% RSD Current instrumentation incapable of timely analysis Ordela 8600 Alpha Sciences 1950 Precision/Counting Time trade off Counting time determined by detector size Alpha counting rates relative to background Solution: Increase signal and/or decrease noise Background effect on counting time Material Requirements - Future 0.001 ??hr?1?cm?2 material in manufacturing Technology roadmaps: 0.0002 ??hr?1?cm?2 in 2006 2 ?’s from 1 square meter area per hour! With current measurement technology this would take 228 days to measure with 20% relative precision Where is the specification bottom? Design dependent Where influences other than cosmic are insignificant Measurement times compatible with manufacturing schedules Instrumentation improvement required Instrumentation for the Future Measure increasingly low a