大功率LED多芯片模块散热器设计与封装结构热阻分析-材料加工工程专业论文.docx

摘 要 LED 照明由于具有效率高、能耗低、寿命长、环保等诸多优点而被视为第 四代照明光源。对于不同的使用环境，LED 芯片散热存在不同的限制条件，需 要不同的热设计方案。随着单颗 LED 芯片功率的不断提高，需要有更好的封装 结构设计来满足越来越苛刻的散热要求。 复杂外形大功率 LED 路灯，由于灯具阻碍空气流动，难以通过自然对流方 式散热。提出热管鳍片散热方案，将热量通过热管传导到空气流动通畅的空 间，通过热管上附着的鳍片完成自然对流换热。优化鳍片间距和鳍片尺寸，强 化自然对流散热。 针对车用大功率 LED 照明灯，提出了水冷热沉散热设计。通过数值模拟方 法，指出了进口流量、结温和水泵功率三者的关系。比较了热沉内部串联方 式、伪串联方式、并联方式和伪并联方式四种水道的优劣。研究了并联方式中 鳍片厚度、进口流量等因素对散热的影响。研究了并联方式中结温与各条分水 道流速的相对标注偏差（RSD, Relative Standard Deviation）值之间的关系和降 低 RSD 值的方法，并指出分流因子 K 是影响 RSD 值的最显著因素。 对 PN 结至热沉热传导的各个环节热阻进行了分析。通过测量 DCB 基板和 Cu-TIM-Cu 结构热扩散系数计算了 DCB 基板内部和 TIM 层的接触热阻。老化 Cu-TIM-Cu 结构并测量其热扩散系数，研究散热结构在长期热载荷下的热阻变 化。提出了实际热流热阻概念，指出由于热流限制，DCB 基板实际热流热阻比 理论热阻高一个数量级。基板刻蚀型反光杯设计用以降低 DCB 基板实际热流 热阻。水冷散热方式时，热阻主要由热传导环节构成，芯片和 chip TIM 层热阻 最大。通过间接计算，指出 LED 芯片 5μm 厚多层膜结构的当量导热系数为 0.9155W/(m·K)。放大衬底垂直结构 LED 设计可以使热流在芯片衬底内有一定 横向扩散，芯片衬底、chip TIM 层和 DCB 基板的实际热流热阻均有降低。 关键词：LED 封装；热设计；水冷；RSD 值；实际热流热阻 Abstract Regarding high efficiency, low energy consumption, long life and friendliness to environment and so many advantages, LED lighting is considered as the forth- generation illuminating light source. For different use environment, heat dissipating of LED chips meets different restrictions, so different thermal designs are required to meet the demand in different places. With the single LED chip power rising, better packaging structure is needed to meet the increasing heat dissipating requirement. For high-power LED street lamps of complex shape, as air flow is obstructed by light shell，it is difficult to dissipate heat through nature convection. Fin heat pipe is select to solve the problem, heat is conducted through heat pipe to unobstructed space for air flow, and then dissipated through nature convection on fins. Fin size and fin spacing have been mathematical optimized to enhance nature convection heat transfer. Water cooling is selected for automobile high-power LED. The relationship between inlet flow rate, temperature of PN junction and pump power has been investigated by numerical simulation analysi