各向异性导电胶中柔性颗粒化学镀镍研究-纳米科学与技术专业论文.docx

华中科技大学硕士学位论文 华 中 科 技 大 学 硕 士 学 位 论 文 I I 摘 要 各向异性导电胶是一种具有很高价值的新型的封装材料，但它的制造涉足到多 个学科分支。本文以各向异性 导电胶这一新型无铅互连材料的填充粒子为主线，以 柔性导电微球的化学镀镍为主要内容，综述了各向异性导电胶在电子封装中的地位 与发展现状，开发了各向异性导电胶制造的核心技术－单分散高分子微球的表面金 属镍覆层技术。 本论文中我们对颗粒表面镍覆层工艺进行了深入研究。具体制备工艺分为四步： 微球表面化学粗化，敏化，活化和化学镀。通过大量试验，调整了反应时间，控制 反应速度，改进前处理工艺等，最终得到优化工艺。该工艺耗时约 25 分钟，在直径 约 3.7 微米的聚苯乙烯微球表面均匀覆盖了一层光滑的 0.23 微米厚的镍磷合金层。 整个工艺流程较为复杂，通过多次改进，提高了对各个步骤的精度控制，最终能很 好地控制镀层厚度和质量。 本课题中所制备的覆镍微球为下一步实施镀金等工艺做好了充分准备，也进一 步为各向异性导电胶的制备奠定了良好的基础。 关键词：各向异性导电胶，化学镀镍磷，微球 II II Abstract Anisotropic conductive adhesive (ACA) is an advanced packaging material with lots of merits, but its manufacture is of high tech upon multiple branches of knowledge. This thesis was organized by the clue of preparation of the metal-coated microspheres applyed in anisotropic conductive adhesive (ACA) and all the experimentations were focused on the electroless plating of conductive micro-spheres for ACA. After the introduction of the basic knowledge and current development of ACF in electronic package, the key technologies of conductive micro-spheres for anisotropic conductive adhesive (ACA) were developed, and the technologies were the nickel coating on the micro-spheres. In this thesis, a step of preparing the conductive particles of ACA was investigated, that is, electroless nickel plating on polymer microshperes. The process of the coating formation consists of four steps: chemical etching, sensitization, activation, and electroless plating. After a mount of experiments we change reaction time, control the rate of reaction, improve the preceding treatment, finally get the optimized process: 0.23 ?m in thickness uniform and smooth Ni-P coating on 3.7 ?m in diameter polystyrene microspheres was formed upon 25 min plating. The advantage of this plating process is to ensure an easy and accurate control on the thickness and the quality of the plating coat. The preparation of nickel-coated microsphere is ready for the further gold plating and the manufacture of ACA. Keywords: