高速电路中通孔结构的电磁建模与分析-电磁场与微波技术专业论文.docxVIP

AbstractIt Abstract It will be development trend that electronic products becoming miniaturization and high perfolmanee，which decides that the clock矗equency will becoming more and more higher and the rise time will becoming more and more shorter． At low frequencN the parasitical effects induced by interconnection lines have little influence circuit performance．But in high-speed circuit the signal has wider effective bandwidth，SO that the connection lines will induce reflection and ringing when transmitting the high—speed signal，and at the same time there some crosstalk and coupling among connection lines and signal traces，which will induce a series of signal integrity(SI)problems and affect the whole system performance． The vias are discontinuous connections，which will induce more serious signal integrity problems and electromagnetic interference(EMI)．So it is very important that vias modeled and simulated accuratelN speedily,efficientlN Electromagnetic modeling and characteristic of vias are investigated in high·speed circuit．The main research works are outlined as follows： 1 The single—layer vertical vias are modeled based Foldy-Lax equation． The each single·-layer vertical vias are looked as multi-·port network and the multi—layer vertical vias modeled by muki-port network cascade theory， Scattering characteristic analysis was given at different geometry structure by numerical simulation results． 2．The whole vias are modeled based on the modeling of throu曲hole via and vertical vias．First，the whole vias axe decomposed into exterior structure and interior structure．Then the exterior structure is decomposed into short circuit problem and wire antenna problem，and the interior structure is decomposed into some single—layer vertical vias．At last，all decomposed parts are connected by the continuity of currents at ports of every II decomposed—part．The decomposed—part．The simulations are given and the loss characteristic of whole vias is discussed． 3．T