IC晶圆表面缺陷检测技术分析.pdfVIP

ABSTRACT ABSTRACT With the rapid development of IC manufacturing technology, the continuous decrease of feature size makes the defects even smaller. Surface defects of wafer have become a major obstacle to yield. How to detect defects of wafer automatically and accurately is a complex and challenging task. Defects detection technology is the key technology in IC industry. The thesis has deeply researched the surface defect detection technology. In this thesis, we use image processing technology and super-resolution technology to detect the defects of IC wafer. Image processing includes image filtering, feature extraction and image matching algorithm. Super resolution technique can produce a high-resolution (HR) image from a set of low-resolution (LR) images with complementary information 。 The main results and conclusions of this paper are summaried as followsing: First of all，this thesis discussed the source of defects during wafer fabrication. According to the morphological characteristics of defects, defects can be divided into redundancy material defect, crystal defect and mechanical damage.The main factors affecting the accuracy were analyzed in defect detection, such as the choice of light source and beam modulation. Choosing shorter wavelengths of laser and using optical interferometric microscopy were effective measures to improve the accuracy. Secondly, using OpenCV can greatly improve the efficiency of the algorithm and enhance system scalability. This paper implemented linear filter and median filter by OpenCV. Median filter reserved more image detail than the linear