厚膜混合集成电路可靠性分析与提高-电子科学与技术专业论文.docxVIP

厚膜混合集成}U路丌J稚州分析o 厚膜混合集成}U路丌J稚州分析o J提I矗 摘 要 本文介纠J，电子J山：鼎nJ．靠性问题的提出及发展情况，并指 r 可靠性分析与可靠性学科其它分支相比发展速度最快，这也为提高 广：，铺的可靠性提供了更14芦实的基础。混合集成电路(H1C)充分利 用．、卜导体集成电路(SIC)高集成度、高速等特点，形成新一代高 级的微电子组装技术，』i：已成为实现军用电子装备小型化、多功能 化、高·陆能化、高町靠性的币：要技术途径。闪此，J-t：展对厚腆混合 集成电路可靠性分析j1：作，采取有效措施，提高，II自身的可靠性：具 有非常雨要的意义。 水文削述J，有关I刈靠性分析的技术及途径，总结．r厚腆混合集 成IU路的1i要火效模式，ji：在此基础I：，从厚膜混合集成I【_!l路的设 讣、外购原材料、一【：艺及使川等符力’嘶，分析1r，㈦扎牛的原1人I。坡 后，针对反映出的牛产和使用中的问题，提f．1{了切实可行的改进办 法，并席用。『J实际，祀，铺得到验证。冈此，本文对如何设计、牛，^。有 i高可靠性要求HIC产：品具有重要的参考价值。 【关键词】 厚膜混合集成电路 nJ‘靠。胜 r·J靠度 火效率 火效模式 火效机理 The The Reliability—Analysis for HIC and Its Improvement HouCui Qun Abstract 1Fhis article Introduces the emergence of electric products reliability and its de、eelopment，it also points out that Reliability Analysis is the quickest developing subject comparing with other branch subjects derived from the subject of Reliability．HIC has been the important technical channel for realizing the small—scale，multi—functional，high— performance，highly reliable military electric equipment，for HIC make good of high—integration，high—speed and other characters of SIC， and formed new-generation advanced microelectronic assembly technique．So starting the HIC Reliability Analysis，taking effective actions，improving the products’Reliability very instructive． This article tells the technology and channels for Reliability Analysis， sums up the main failure modes of HIC products．Based this，it brings about well the why failures happen by analyzing the designing，raw material purchasing，technology,service and other factors of HIC manufacture．At last，just aimed at the problems happened in processes and services，some practical improving methods put forward，and applied in practice with the final verification to be right． Thus，the article is of highly referential value for design and manufacture of HIC products with strict demand for high-reliability． Ⅲ究生论文专用纸 f*!I学位沦义： f*!I学位沦义： 厚膜混合集成IU路uJ靠忡分析’i提高 KevWords Hybrid Integrated Circuits(HIC) Reliability Reliability Degre