影响银浆电极电导率的微观机制-华东理工大学学报.PDF

DOI:10.14135/ki.1006-3080.20180403003 影响银浆电极电导率的微观机制 姚珊珊， 张杰峰， 杨云霞， 仝华 （华东理工大学材料科学与工程学院，教育部超细材料重点实验室，上海200237） 摘要：通过扫描电子显微镜观察银浆在烧结过程中的微结构演变，探讨了银粉的形貌、尺 寸和聚集状态，以及玻璃相添加剂等因素对电极电导率产生重要影响的微观机制。研究发现， 银浆烧结过程中晶粒的生长速度和体相结构的致密化程度与这些因素有着密切关系。通常，生 长的晶粒尺寸越大、烧结的体相结构越致密，电极电导率也就越高。玻璃相一方面会促进银粉 烧结，利于提高电极电导率；而另一方面又会阻碍晶粒间的电子传输，导致电极电导率变小。 关键词：银浆；银粉；电极；电导率；微观机制 中图分类号：TM241.1；TB31 文献标志码：A Microscopic Mechanism of Influences on Silver Paste Electrode Conductivity YAO Shan-shan, ZHANG Jie-feng, YANG Yun-xia, TONG Hua （Key Laboratory for Ultrafine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai200237, China） Abstract: In view of extensive application of silver (Ag) paste metallization in the manufacture of electronic devices, it is of great significance to master sufficient knowledge about the main factors that affect the Ag paste electrode conductivity. Although so far many progresses have been made in the improvement of Ag paste technology, there is still a lack of comprehensive understanding of the microscopic mechanism about Ag paste sintering. Herein, exemplifying with the Ag paste for crystalline silicon solar cells, this article attempts of explore the relation of electrode conductivity to those factors, including the grain size, morphology and aggregation state of Ag powder used, glass phase additive in the Ag paste, sintering temperature and so on by investigating the microstructure evolution of silver paste in the process of high temperature co-sintering at silicon