电解铜箔表面结构及性能影响因素-中南大学学报.PDF

第 41 卷第 6 期 中南大学学报( 自然科学版) Vol.41 No.6 2010 年 12 月 Journal of Central South University (Science and Technology) Dec. 2010 电解铜箔表面结构及性能影响因素 黄友明，王平，黄永发 (江西省江铜−耶兹铜箔有限公司，江西 南昌，330096) 摘 要：对铜箔进行化学处理，考察阴极钛辊表面粗糙度及阴极钛辊的腐蚀对铜箔的性能及表面图像影响。研究 结果表明：增加处理液中 Cu2+浓度及提高电流密度，有利于表面粗糙度增加，抗剥离强度增大，蚀刻因子 Ef 降低。 若同时降低浸泡复合液中 Cu2+和 Zn2+浓度，增加 Sb2+浓度，则表面粗糙度及抗剥离强度降低，蚀刻因子增加；复 合液中 Sb2+浓度增加也能使表面粗糙度增加，蚀刻因子增加，但是，抗剥离强度基本没有变化。添加 CuSO4 后， 阴极钛辊腐蚀速度下降，当CuSO4 质量浓度达到 20 g/L 后，钛的耐腐蚀速度在 0.050 mm/a 以下；当钛辊表面粗 糙度 Rz 降低时，电解铜箔表面相对平整，晶粒大小较均匀，排列较规则。 关键词：电解铜箔；化学处理；表面粗糙度；腐蚀 中图分类号：TG166 文献标志码：A 文章编号：1672−7207(2010)06−2162−05 Surface structure and performance of electrolytic copper foils HUANG You-ming, WANG Ping, HUANG Yong-fa (Jiangxi Copper−Yates Foil Corporation, Nanchang 330096, China) Abstract: Effects of surface roughness and erosion of titanium cathode drum on performance of electrolytic copper foils and surface images were studied by chemical treatments. The results show that surface roughness and contradict debonding intensity increases and etch factorial (Ef) decreases with the increase of copper concentration and electric current density. When the concentration of copper and zinc of leached compound solution decreases, surface roughness and contradict debonding intensity decreases but etch factorial (Ef) increases. When the concentration of Sb2+ of leached compound solution increases, surface roughness and contradict debonding intensity increases but etch factorial (Ef) has litter change. The erosion rate of titanium cathode drum decreases when CuSO4 is added. When the mass concent