基于机器视觉的IC芯片焊点定位检测与误差分析-机械制造及其自动化专业论文.docxVIP

研究生优秀毕业论文 定位算法设计，实时的校正在引线键合过程中由贴片和芯片制造产生的误差。通过对裸芯 定位算法设计，实时的校正在引线键合过程中由贴片和芯片制造产生的误差。通过对裸芯 片、基座图像边缘的特点进行分析，本文采用基于几何中心的算法提取出裸芯片、基座图 像的虚拟角点，得N-者的实际位置坐标，从而得N--者位移和角度的修正量，并将其结 果反馈到键合头，可完成高精度、高效率的键合。经过仿真实验验证，该算法可以实现键 合过程中裸芯片、基座位置偏差的实时校正，并且定位精度满足引线键合的工艺要求。 综上所述，本论文对引线键合视觉定位系统进行了深入的研究，对所设计的算法均经 过仿真实验验证，实验结果表明本文提出的算法均具有较高的检测精度和识别率，达到了 比较好的效果。本论文取得的研究成果对于机器视觉定位检测技术、图像畸变矫正技术、 虚拟角点检测技术均具有一定的理论价值和实用价值。 关键词：引线键合；视觉定位；摄像机标定；角点检测 万方数据 The The Location Detection and Error Analysis of IC Chip Solder Based on Machine Vision Discipline：Mechanical Manufacturing and Automation Student Signature： D吻_御 Supervisor Signature： U乩肋 Abstract IC(Integrated Circuit)industry is an important indicator of measuring a country’S comprehensive stren昏h．It is an significant support for changing the development model and enhancing the level of industrial development．The packaging technology of integrated circuit is a very essential foundation for changing the IC chips into microelectronic devices with practical value．Therefore，the research on the wire bonding technology which is frequently used in IC packaging technology carries great importance． Machine visual technology is playing an increasingly important role in the process of automatic production due to its advantages：non-contract，hi【曲efficiency and high precision． Meanwhile，in order to meet the demands for high integration，high accuracy and high refimng， which are proposed by the wire bonding technology,this present thesis introduces machine visual technology into the study of wire bonding technology．Besides，the present study focuses on the visual locating system which is related to the wire bonding technology．It also studies the ways of establishing experimental platform according to the requirements put forward by the wire bonding technology．And this thesis pays close attention to the design of software-positioning algorithm，which needs the connection of machine visual technology and image processing technology．The main research contents of