晶圆级封装技术对半导体产业的影响及在中国的应用分析-工商管理专业论文.docxVIP

摘要半导体产业以发展迅速而著称，技术创新一直是推动产业发展的 摘要 半导体产业以发展迅速而著称，技术创新一直是推动产业发展的 主要驱动力，晶圆级封装技术是近年来半导体封装领域出现的一项重 大技术变革。 晶圆级封装技术采用了与传统封装技术截然不同的工艺，其主要 的优势是芯片的尺寸更小，成本更低，各种性能也有了明显的提高。 本文根据技术创新的相关理论，对晶圆级封装技术进行了评估，并且 分析了此项新技术对半导体产业结构的影响。 作者利用技术扩散的基本知识分析了晶圆级封装技术的扩散过 程，然后分析了晶圆级封装产业化过程中面临的风险，包括技术风险 和市场风险，为了避免这些风险，有两个封装联盟在推动晶圆级封装 技术的标准化和产业化，作者对这两个联盟组织进行了详细的比较。 最后，作者试图分析晶圆级封装技术成为主流技术的条件，来判断该 技术未来的发展趋势。 同时，随着近几年中国半导体产业的蓬勃发展，作者以投资于晶 圆级封装的泰隆(Ace Semiconductor)半导体上海公司为案例，分析了 引入此项先进封装技术对中国半导体产业的促进作用，以及介绍了泰 隆半导体在中国的商务模式。 关键词：晶圆级封装技术创新技术扩散技术风险战略联盟 ABSTRATThe ABSTRAT The semiconductor industry is often cited as a dramatic industry because unceasing technological innovation is the major drive for the industry．In recent years，Wafer Level Package emerged as all important technological innovation in semiconductor assembly field． Wafer Level package is a newer technology that breaks away from conventional mode of packaging．The major advantages of Wafer Level Package ale smaller size，lower cost,shorter manufacturing cycle time， and better characters for IC products．In this paper,the author evaluated the wafer level package technology by using some related technological innovation theories，and also studied how this technology will influence the current industry slructure． The author studied the diffusion procedure of wafer level package according as technological diffusion theory．While industrializing wafer level package technology,the adopters will face two different types of risk：technology risk and market risk，to avoid the risks，two strategic alliances were formed，they committed themselves to industrialize Wafer Level Package technology,and competed each other for the standard of the new technology．Lastly,the author打y to identify the conditions of which Wafer Level Package could be a major technology in semiconductor semiconductor industry,and forecast the future ofthe technology． China has been a booming semiconductor market in these years．The author studied the case of Ace Semiconductor,which adopte