已修改 Sn-Zn-Bi加Ni.pdfVIP

Materials Chemistry and Physics 123 (2010) 629–633 Contents lists available at ScienceDirect Materials Chemistry and Physics j o u rn al h omepage: w w w. elsev /locate/matc hemphys Interfacial reactions between Sn–8Zn–3Bi–xNi lead-free solders and Cu substrate during isothermal aging Lijuan Liu, Wei Zhou, Baoling Li, Ping Wu ∗ Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, PR China a r t i c l e i n f o a b s t r a c t Article history: In this work, interfacial reactions of Sn–8Zn–3Bi–xNi (x = 0, 1) lead-free solders with Cu substrate and the Received 8 September 2009 growth of intermetallic compounds (IMCs) during isothermal aging were investigated. After soldering at Received in revised form 17 April 2010 250 ◦ C for 90 s, the Cu Zn and CuZn phases formed at the Sn–8Zn–3Bi/Cu interface and only the Cu Zn 5 8 5 5 8 Accepted 8 May 2010 ◦ phase was found at the interface of the solder with addition of Ni. During aging treatment at 150 C for 100, 400 and 900 h, the CuZn5 IMC at the Sn–8Zn–3Bi/Cu interface transformed to the Cu5Zn8 d