PCB工程咨询中英文对照总结.docxVIP

问题：客户未告知采用什么标准进行制作与检查。 建议：我们按 IPC-6012B Class2 与 IPC-A七OOG Class2 做。 Questi on 1: Customer does nt tell us what standards we should take to manufacture and in spect. Suggestion: We will follow IPC-6012B Class2 IPC-A-600G Class2. 问题：客户未告知板料类型。 建议：我们将使用FR4. Question: Customer does nt tell us material type ? Suggestion: We will use FR4. 问题：客户要求成品厚度为1.60+/-0.10mm,此公差对六层板而言太紧，难以控制。 建议：将公差放松到+/-0.15mm. Question: Customer requires U1.60+/-0.10mmM finished board thickness, the toleranee is too tight for six -layer board., ifs hard to control for us. Suggestion: Relax the toleranee to be +/-0.15mm. 问题：客户未规定使用何种类型的阻焊油及颜色。 建议：我们采用普通感光绿色湿油. Question: Customer doesnl specify solder mask type and color. Suggest!on: We use normal green LPI. 问题：客户未指定UL标记与Date code加于何处及以何种方式显示。 建议：见下图，我们将其加于TOP面，以白字显示。 Question: Customer does nt specify where and by what display form we should add UL logo and date code? Suggestion: See below picture, we add them on top side and display them by silk letters? 问题：客户要求线路表面油厚为30um min,线路拐角位为20ummin,此要求太高。 建议：线路油表面厚与线路拐角位油厚分别放松到15um min与10um min. Question: Solder mask is required to be 30um min over line and 20um min at corners, ifs too strict. Suggestion: Relax it to be 15um min over line and 10um min at corners, 问题：客户未规定緣金厚度要求。 建议：我们按線厚2.54um min,金厚0.03—0.08um制作. Question: Customer does nt specify thickness of Ni and gold. Suggestion: Ni: 2.54um min and gold: 0.03—0.08um. 问题：客户未清楚指明层序。 建议：层序为： Question: Customer doesnt indicate layer sequence? Suggestion: Layer sequenee is 问题：客户未规定压板结构。 建议：按下图所示做。 Question: Customer does nt specify lay-up structure ? Suggestion: Follow below picture to do. 问题：客户未规定如何对电测试OK的板加注标记。 建议：A)板边划一条黑线。 B)板内盖白色的T印。 Questi on: Customer does nt specify how to take a mark for UE-Test OK” board. Suggest!on: A) Mark a black line at edge-board? B) Take a white stamp on board? 问题：客户未指定V-CUT标准。 建议：V?CUT角度为30°±5°,余厚为0.40+/-0.10mmo Questi on: Customer does nt specify V-cut stan dard ? Suggestion: V-cut angle: 30°±5°, residue thickness: 0.