功率循环测试中衬底焊接层的可靠性.PDFVIP

4/2010 1 电力电子器件与应用 率循环测试中衬底焊接层的可靠性 Thomas Hunger Reinhold Bayerer （德国） 英飞凌科技股份公司，瓦尔施泰因） 摘 要：基板与陶瓷衬底之间的焊层寿命通常利用IGBT 模块的被动加热和冷却（热循环）来测试，但这种 试验会引起焊层失效（分层）。实际应用中 IGBT 和二极管芯片是主动被加热的，诸如焊线脱落等其它模式的失 效也会限制使用寿命，通常可通过功率循环试验来评估这种应力的影响。本文通过功率循环试验来评估衬底焊层 的失效，利用高循环周次的测试进行有效的衬底焊层热循环试验，其关键在于功率循环过程中焊层温度的 测。 在温度波动不大的条件下 比较了被动热循环和主动功率循环时对焊接寿命的影响。 关键词：功率循环试验；热循环试验；寿命终止裂纹长度；温度波动 中图分类号： 文献标识码： 文章编号： TN303 A 1671-84 10(2010)04-0001-04 Reliability of Substrate Solder Joints from Power Cycling Tests Thomas Hunger, Reinhold Bayerer (Infineon Technologies AG, Warstein , Germany) Abstract: The lifetime of the solder joint between base plate and ceramic substrate is u sually tested by passively heating and cooling the IGBT module (thermal cycling). This provokes failures (delamination) in that solder layer. However, the IGBT and diode dies are actively heated in the application . Other failure modes (e.g. bonding wires lift off ) are addressed and limit the lifetime. This kind of stress is u sually tested via power cycling. In the present paper the power cycling test results are evaluated with respect to failures in the substrate solder. Those tests with their high number of cycles are utilized as an effective thermal cycling test for the substrate solder. Key factor is the prediction of the solder temperature during power cycling. A comparison of the solder joint lifetime was carried out between passive thermal cycling and active power cycling at low temperature swings. Key words: power cycling test; thermal cycling test; EOL(end of life) crack length ; temperature swing