线路板的中英文对照.docVIP

线路板的中英文对照 * Process Module 说明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔 (Blind Buried Hole Drilling) C. 干膜制程 ( Photo Process(D/F)) c-1 前处理 (Pretreatment) c-2 压 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 显 影 (Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping) c-7 初检 ( Touch-up) c-8 化学前处理,化学研磨 ( Chemical Milling ) c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination) c-10 显 影(Developing ) c-11 去膜(Stripping ) D. 压 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蚀 (Microetching) d-3 铆钉组合 (eyelet ) d-4 迭板 (Lay up) d-5 压 合 (Lamination) d-6 后处理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 铣靶 (spot face) d-9 去溢胶 (resin flush removal) E. 减铜 (Copper Reduction) e-1 薄化铜(Copper Reduction) F. 电镀 (Horizontal Electrolytic Plating) f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating) f-3 低于 1 mil ( Less than 1 mil Thickness ) f-4 高于 1 mil ( More than 1 mil Thickness) f-5 砂带研磨 (Belt Sanding) f-6 剥锡铅 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 预烤 (Precure) g-3 表面刷磨 (Scrub) g-4 后烘烤 (Postcure) H. 防焊(绿漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 静电喷涂 (Spray Coating) h-4 前处理 (Pretreatment) h-5 预烤 (Precure) h-6 曝光 (Exposure) h-7 显影 (Develop) h-8 后烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 喷砂 ( Pumice)(Wet Blasting) h-12 印可剥离防焊 (Peelable Solder Mask) I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) i-2 电镀软金 (So