纳米银焊膏的烧结性能及其用于铜连接的研究-JournalofSystems.PDF

5 Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste , , , ( , 100084) AN Jian-feng,ZOU Gu-i sheng,LI Jian,WU A-i ping (Key Laboratory for Advanced Manufacturing by Materials Processing T echnology( Ministry of Education) ,Department of Mechanical Engineering, Tsinghua University,Beijing 100084, China) : 20~ 80nm , (SEM), 200 30min , ;250 250 ,10M Pa , 39MPa, , SEM , SEM , : ; ;; : TB31 : A : 1001-4381( 2010) 10-0005-04 Abstract: Ag nanoparticle paste with size distribution of 20-80nm was prepared by chemical reduction reaction. Each nanoparticle was covered with a thin organic shell which can prevent its aggregation. Micro-structural evolution was observed using scanning electron microscope (SEM) . T he results sug- gested that the sintered Ag layer was a connected porous-structure after sintered for 30min at 200 . At sintering temperature above 250 , some Ag grains grew up obviously. T he sintering-bonding with Ag nanoparticle paste of silver plated pure coppers was performed at 250 under 10MPa. The joint had a shear strength of 39MPa. T he microscopic analysis of sintered Ag layers from the sheared fracture appearanceof joints showed that sintered Ag layer had a dense structure. T here was no obv-i ous trace of plastic distortion at the low magnification SEM images of fracture-appearance of joints. However, at high magnification SEM images displayed the dimple structure feature which is typical microstructure at fracture surface of ductile material. Key words: Ag nanoparticle paste;sintering characteristic;bonding;electronic pac