smt焊膏质量跟测试焊（doc 10页）文档.docVIP

SSMT焊膏质量与测试焊 摘??要：随着电子封装向高性能、高密度、微型化的发展，焊膏材料和技术显得极为重要。本文讨论了表面安装技术（SMT）焊膏的焊粉质量、焊剂载体要求以及焊膏的基本性能测试。SMT焊膏质量与测试 关键词：焊膏、焊粉、焊剂载体 The Quality and Testing of Solder Paste for SMT Abstract: Because of the development of high density, high performance and miniaturization in electronic packaging, solder paste material and technology become more and more important. This paper discussed the quality of SMT solder paste, including powder preparation, flux vehicle formulation and basic testing. Keywords: solder paste, solder powder, flux vehicle 1引言 焊膏是由合金焊粉、焊剂载体等组成的膏状稳定混合物。在表面安装技术中起到粘固元件，促进焊料润湿，清除氧化物、硫化物、微量杂