一诺银合金丝产品介绍.pptVIP

Welcome to 热烈欢迎 ;烟台一诺电子材料有限公司 Yantai YesNo Electronic Materials Co.,Ltd ;◆ 键合丝 Bonding wire 银键合丝 Silver bonding wire 铜键合丝 Copper bonding wire 铝键合丝 Aluminum bonding wire ◆ 靶材、蒸发材 Evaporating / Target Materials ;◆金/银/铜/铝等键合丝 Gold/Silver/Aluminum /Copper etc. Bonding wire ◆贵金属蒸发材、靶材、焊线， 以及用于特殊用途的合金材料 Evaporating precious metal ,Target Materials, Solder wire and other alloy for multipurpose applications ◆航空发动机/辐射保护等材料 Aero engine/Radioprotection etc. materials ;主要产品和服务(2/2) Mainly Products Services;6N高纯原料;;物理性能参数(金银铜铝) Physical properties (Au, Ag, Cu, Al) ;熔断电流对比(1/2) Comparisons of fusing currents;熔断电流;金属间化合物增长对比 Comparisons of IMC ;键合丝使用成本比较（1/2） Cost comparisons of different bonding wires;键合丝使用成本比较（2/2） Cost comparisons of different bonding wires; ;优点 Advantages ◆较好的导电和导热性能 Good electric and thermal conductivity ◆较好的抗腐蚀和抗氧化性能（与铜比较）Good corrosion and oxidative resistance (Compared with Cu) ◆仅需氮气保护，比较安全（与铜比较）N2 as protective gas only (Compared with Cu) ◆硬度较低（铜比较）Lower hardness (Compared with Cu) ◆成本较低-金的1/5-6 Lower price-1/5-6 to Au;银丝机械性能参数 Mechanical properties of Ag bonding wire;银丝和真球硬度 Ag Wire FAB Hardness ;银丝的热影响区 HAZ of Ag bonding wires;银丝焊接性能 Welding performance of Ag bonding wire ;银丝抗腐蚀性能 Corrosion resistance of Ag bonding wire;银丝应用范围 Applications of Ag bonding wires;银丝的应用趋势 Ag Bonding Wire Application Trend;银丝专利及RoHS证书 Our patent and RoHS certificate of Ag bonding wire;为什么选择铜丝(1/3) Why Cu wire ;;为什么选择铜丝 (3/3)Why Cu wire;铜丝的特性 –优点（1/2) Features of Cu bonding wire -advantage;金属间化合物（IMC）生长缓慢，提高可靠性。 The reliability are enhanced because of the slow growth of IMC.;1.易氧化，储存及键合期间需采用专门设备及气体进行保护。 The oxidation of Cu, special equipments and gases are needed to protect it during bonding and storage. 2.硬度比较大，容易对芯片造成伤害。 The pad is li