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- 约3.74万字
- 约 59页
- 2019-05-11 发布于上海
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华
华 中 科 技 大 学 硕 士 学 位 论 文
II
II
Abstract
IC (integrated circuit) industry is one of the basic and strategic industries of the national economy for China, and the level of technology and industry of IC is an important symbol of a national science and technology, industry and national defense strength. IC packaging equipment is the important IC manufacturing equipment, the technology level of which directly affects the development trend of IC industry. At present, our country has gradually become the global IC manufacture center, and has achieved rapid development of technology in the field of IC packaging. However, comparing with the United States, Japan, Korea, Europe and other major IC packaging equipment production countries, our country has not yet been fully master all of key technologies of IC package equipment.
The machine vision inspection and measurement technology has become the core technology of IC packaging equipment, and directly affects the performance of the IC package equipment. Now, the development trend of IC packaging appears miniaturization, high speed and density, and the traditional vision system cannot be able to meet the demand of development of IC package equipment. Thus, the development of low cost, high speed and high precision embedded vision system has become a key and important technology of high-performance IC package equipment.
In order to overcome the technical problems of high-speed vision inspection and measurement of IC package equipment, this study introduces an embedded vision hardware system design. The content of this study are as follows: the function demand analysis, the system design of embedded vision, the selection of hardware chips, the design of hardware circuit of embedded vision, PCB design plate of embedded vision, and the realization of image processing algorithm by using FPGA hardware circuit and DSP. The principle diagram of the hardware design including: design of Camera-Link image data acquisition interface cir
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