20XX年BGA封装工艺简介.pptVIP

Introduction of BGA Assembly ProcessBGA 封装工艺简介;BGA Package Structure;Typical Assembly Process Flow;FOL– Front of Line前段工艺;FOL– Front of Line Wafer;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Optical Inspection;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;;FOL– Epoxy Cure 银浆固化，检验;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL–Optical Inspection 检查;;Material Problem;;;;;;; 2nd Bond Fail ( II ); Looping Fail(Wire Short I);Looping Fail(