金合金导电环用低脆性钎料研究-航空制造技术.pdfVIP

研究论文 RESEARCH 金合金导电环用低脆性钎料研究* 牟国倩，曲文卿，寇璐璐，庄鸿寿 （北京航空航天大学机械工程及自动化学院，北京 100191 ） [摘要] 采用共晶 SnPb 钎料和自制 InPbAg 钎料对导电环中的金合金片与镀银铜导线进行钎焊连接，对两种钎焊 接头显微组织、化合物成分、硬度及力学性能进行对比分析，探讨自制 InPbAg 钎料对接头脆性的影响。结果表明： SnPb 钎料 / 金合金界面产生层状分布的 IMC 层，主要成分为 AuSn 、AuSn 、Ag Sn 等脆性金属间化合物；InPbAg 钎 2 4 3 料 / 金合金界面 IMC 层很薄，主要成分为 AuIn 、Ag In 化合物相，其硬度均低于 SnPb 接头界面 IMC 层硬度，说明 2 2 InPbAg 接头界面金属间化合物脆性相对较低。力学性能分析显示，InPbAg 接头力学性能稳定性相对较高，SnPb 接 头为脆性断裂，InPbAg 接头为塑性断裂。 关键词：金合金；导电环；脆性；界面金属间化合物（IMC ）；钎料 Study on Low Brittleness Solder for Gold Alloy Conductive Ring MU Guoqian, QU Wenqing, KOU Lulu, ZHUANG Hongshou ( School of Mechanical Engineering Automation, Beihang University, Beijing 100191, China ) [ABSTRACT] The soldering test of gold alloy sheet and silver plated copper wire in conductive ring by using eutectic SnPb solder and self-made InPbAg solder was carried out. The microstructure, compound composition, micro-hardness and mechanical property of the two kinds of soldering joints were compared and analyzed, and the influence of the self-made InPbAg solder on the brittleness of the joints was discussed. The results show that the SnPb solder / gold alloy interface produces a layered IMC layer, and the composition is brittle intermetallic compounds of AuSn , AuSn , Ag Sn; IMC layer of InPbAg solder / gold alloy interface is very thin with the composition of AuIn , 2 4 3 2 Ag In phase, and their hardness are all lower than that of SnPb joint, which indicates that the brittleness of InPbAg 2 intermetallic compound is relatively low. The mechanical property analysis shows that the mechanical properties of InPbAg joints are relatively stab