纯玻璃触控技术比较.pptVIP

* * RGB Process _ part 2 (2F_RGB line) B顯影成膜及硬烤 G光阻塗佈 = Spin 曝光 B顯影成膜及硬烤 三色成品檢驗 Slit coater OC Process (2F_Thermal OC line) 烘烤 OC layer塗佈 Spinless RGB基板 ITO Process RGB+OC基板 鍍好ITO膜之基板 在基板上放遮罩 移去遮罩之成品 濺鍍 ITO靶 MVA Process (4F_MVA line) MVA光阻塗佈及旋轉 顯影 烘烤 MVA光罩 曝光 UV 燈 PS Process (2F_PS line) PS光阻塗佈及旋轉 顯影 烘烤 PS光罩 曝光 UV 燈 TPII Mask Design 1. TPII 5m X 5m design ( Cypress Design ) 2. TPII 5m X 5m design ( for Yokohama ) TPII V1 : 根據Cypress Design Guide line 設計 Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Sensor bridge width = 50um Space = 0.3mm V2 Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Dummy width = 240umITO spacing = 30um Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Dummy width = 60umITO spacing = 30um Sensor density = 14*8 TPII Type G v2 Design Capacitive Sense Touch panel (Sample output:8/E) Glass sensor dummy dummy dummy sensor dummy 30um Sensors in 2 plane Sensors in the same plane A ITO300A SiNx1000A ITO300A PC4033um ITO300A PC4033.0um ITO300A PC4033um ITO300A PC4033.0um ITO300A PC4033um Glass sensor sensor dummy 30um Glass sensor sensor 30um 60um ITO bridge B Cypress : 10k TPII v2 : 40~50k (14X), 105pF (14X) Type 1st insulator 2nd insulator T% ( x, y ) R 7.5X (1X) B SiNx PC403 95.36% (0.315,0.322) 28.8K (4.6k) B PC403 PC403 91.53% (0.316,0.323) 23.6K (3.1k) A PC403 PC403 91.90% (0.321,0.329) 23.2K (3.1k) LCDs with Integrated Touch Panel  (Current status) AUO SamsungiTSP SamsunghTSP TMD Wintek Cypress CapSense SynapticOnyx Sensor Type In-cell Capacitive / Switch Sensor ExternalResistive Sensor In-cell Capacitive Sensor In-cell Photo Sensor In-cell Capacitive Sensor Capacitive(in-cell or integrated on-cell) External Capacitive Sensor Detection Pressure 50g (touch mura) Pressure required Pressure required 0g 0g 0g 0g LCM Thickness LCM only LCM + 1 film LCM only LCM only LCM only LCM only LCM only + external TP Input Method Finger or stylus Finger or stylus Fi