现代学徒制企业课程 PCB专业英语 PCB专业术语.pptxVIP

PCB专业术语 ;PCB(Printed circuit board)：印制电路板 单面印制板：single-sided printed board(SSB) 双面印制板：double-sided printed board(DSB) 多层印制板：multilayer printed board(MLB) 刚性印制板：rigid printed board 挠性印制板：flexible printed board 刚挠结合板/软硬结合板: Rigid-Flex printed board ;物料篇;Solder mask/Solder resist ink 阻焊油墨 Thermosetting type ink 热固化油墨 Silkscreen/Component mark/Legend 字符 Solder, Tin/Lead solder 焊料,铅锡焊料 Drill bit, Rout bit /milling cutter 钻咀,锣刀,铣刀 Chemical 化学的,化学物 Dry film 干膜,是一种能感光,显像,抗电镀,抗蚀刻之阻剂 TG (Temperature of Glass Transition) 玻璃态转换温度 CTE( Coefficient of Thermal Expansion) 热膨胀系数 CTI( Comparative Tracking Index ) 漏电起痕指数(不引起材料因起痕而失效的最大电压数值) Anti-CAF( conductive anodic filament ) 耐离子迁移 Dielectric constant 介电常数(DK/Er) TD( Temperature of Decompose) 热裂分解温度 RoHS( Restriction of Hazardous Substances Directive )危害性物质限制指令 (Lead铅 , Mercury汞 , Cadmium镉 , Chromium (VI)六价铬 , Polybrominated biphenyls ( PBB’s)多溴联苯, Polybrominated diphenyl ethers ( PBDE’s)多溴联苯醚) ;Laminate cutting 开料,裁板 Baking 烤板 Desmear 除胶渣 PTH( Plated-Through-Hole) 镀通孔 Plasma cleaner 等离子清洗 Panel plating 全板电镀,也叫整板电镀 Pattern plating 图形电镀 Image transfer 图形转移 Tin Stripping 褪锡 Etching 蚀刻 Undercut 侧蚀 SES 褪膜-蚀刻-褪锡连线(碱性蚀刻线) DES 显影-蚀刻-褪膜连线(酸性蚀刻线) Etching factor 蚀刻因子(蚀刻系数),主要用来衡量侧蚀量的大小,蚀刻 因子=2*铜厚/(下线宽-上线宽);Solder mask printing 印阻焊 Exposure 曝光 UV cure UV固化(ultraviolet) LPI( Liquid Photo Image) 液体感光成像 Developing 显影 Silkscreen stencil 丝印钢网，简称丝网 Aluminum sheet 铝片 Scrubbing 磨边 DI water 纯水,去离子水( Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子/氯离子/镁离子等 HASL (Hot Air Soldering Level) 喷锡,热风整平 LF-HASL (lead free-hot air soldering level) 无铅喷锡 ENIG/Immersion gold沉金(沉镍金, Electroless Nickel/Immersion Gold ) ENEPIG ( electroless nickel electroless palladium immersion gold )沉镍钯金 HDI( High Density Interconnector )高密度互连 ;Flash gold 水金(电薄金) Hard gold 厚金 Immersion Tin 沉锡 OSP / Entek (Organic Solderability Preservatives) 有机保焊剂,防氧化处理 Immersion silver 沉银 Pressing p