《IC制造流程简介》演示幻灯片.pptVIP

IC制造流程简介ANDY;相关定义;相关定义;相关定义;Wafer Start;製程;The Introduction to The Manufacturing Process of VLSI;晶圓(Wafer);;;微影(Photolithography);;Continue;Doping: To get the extrinsic semiconductor by adding donors or acceptors, which may cause the impurity energy level. The action that adding particular impurities into the semiconductor is called “doping” and the impurity that added is called the “dopant”. ;Pre-deposition: To put the impurities on the wafer surface. Generally used dopant resource furnace design: ;Drive-in: To implant the dopant into the wafer by the thermal process;1. The definition