高可靠性JEDEC1级或2级优异的可塑性模塑料.docx

NEW MOLDING COMPOUNDS FOR COST REDUCTION, NON-POST MOLD CURABLE HIGH RELIABILITY / JED EC LEVEL lor 2EXCELLENT MOLDABILITY EME-6600H series ( INTRODUCTION | TARGET LEVEL JEDEC LEVEL 1 : ；5degC/85 % 168hrs + IR Reflow 240(235-240)degC 3times JEDEC LEVEL 2 : 85degC/60% 168hrs + IR Reflow 240(235?240)degC 3 times APPLICATION SOP, DIP : LEVEL 1 Large QFP, Large PLCC : LEVEL 2 CONCEPT j RELIABILITY Target JEDEC Level 1, 2 without PMC T Low Water Absorption T Higher Adhesion Strength at high temperature T High Flexural Strength at high temperature MOLDABILITY (No Pin-Hole,Void,Sticking,Wire Sweep,Pad Tilt etc.,) T Lower Viscosity and Long Flow T Lower Volatile Matter ￡ TECHNIQUES TO ACHIEVE HIGH RELIABILITY | I) LOW WATER ABSORPTION 2) HIGH ADHESION 3) HIGH STRENGTHAT HIGH TEMP. 4) LOWER VISCOSITYAND LONG FLOW 5) LOW MODULUSAT HIGH TEMP. 6) LOW THERMALEXPANSION NEW DCPD (LOWER VISCOSITY) RESIN SYSTEM HIGH FILLER LOADING SUITABLE FILLER SIZE FILLER SHAPE COUPLING AGENT NEW LOW STRESS ADDITIVE /new STANDARD GRADE [EME-6600H series] |T\ For Auto Mold 6600CRFast Cure6600HR 6600CR Fast Cure 6600HRI Semi-Fast Cure 6600 I 6600 I 6600CS | 6600H 6600DD, CG INormal Cure Void Improvement 6600DD, CG I Normal Cure Void Improvement 6600HD R)r Conventional Mold  FORMULATION 6600H 6600HD 6600HR 6600CS 6300H Filler Content Much Increased Much Increased Much Increased Increased STD Filler Type Much Modified Much Modified Much Modified Modified STD Epoxy Type Low Vis. DCPD+BP DCPD + BP Low Vis. DCPD+BP DCPD OCN Hardener Type STD STD STD STD STD Catalyst Type STD STD STD STD STD LSA Type New New New New STD  COMPARISON DATA | POST MOLD CURE : 175degC/2hrs I ITEM UNIT 6600H Conv. Auto 6600HD Conv. 6600HR Auto 6600CS Conv. Aulo 6300H Mainly Conv. Spiral Flow cm 90 70 80 | 89 80 Gel Time sec 30 40 25 35 40 Kokas vis. poise 180 250 200 | 180 300 Alpha 1 1/degC 0.8 0.8 0.8 1.0 1.7 Alpha 2 1/degC 3.4 3.4 3.4 4.0 6.8 Tg degC 150 150 150 150 165 Flexural Strength(25degC) kgi/mnf 17 17 17 1