memory存储芯片pc28f00am29ewld中文规格书.docxVIP

Asynchronous Data Output Data can be output from a die (LUN) if it is in a READY state. Data output is supported following a READ operation from the NAND Flash array. Data is output from the cache register of the selected die (LUN) to DQ[7:0] on the falling edge of RE# when CE# is LOW, ALE is LOW, CLE is LOW, and WE# is HIGH. If the host controller is using a rRC of 30ns or greater, the host can latch the data on the rising edge of RE# (see Figure 22 for proper timing). If the host controller is using a lRC of less than 30ns, the host can latch the data on the next falling edge of RE# (see Figure 23 (page 33) for extended data output (EDO) timing). Using the READ STATUS ENHANCED (78h) command prevents data contention following an interleaved die (multi-LUN) operation. After issuing the READ STATUS ENHANCED (78h) command, to enable data output, issue the READ MODE (OOh) command. Data output requests are typically ignored by a die (LUN) that is busy (RDY = 0); however, it is possible to output data from the status register even when a die (LUN) is busy by first issuing the READ STATUS (70h) or READ STATUS ENHANCED (78h) command. Figure 22: Asynchronous Data Output Cycles PC28F00AM29EWLD产品详细规格 包装 64Fortified BGA 电池类型NOR 密度1 Gb 建筑 Sectored 块组织 Symmetrical 位置引导块Bottom|Top 典型工作电源电压3|3.3 V 扇区大小 128Kbyte X 1024 支持页面模式Yes 走时类型Asynchronous 工作温度?40to85°C 地址总线宽度21/20 Bit 接口类型Parallel 页面大小16/32 Words 标准包装Trays 安装 Surface Mount 包装竞度11 包装长度13 PCB 64 地址总线宽度21/20 密度1G 典型工作电源电压 欧盟RoHS指令 Compliant 字数 128M/64M 最低工作温度-40 供给商封装形式Fortified BGA 标准包装名称BGA 最有工作温度85 羯程电压 Figure 13: Device Organization for Two-Die Package (BGA) Async CE# CLE-1 ALE-1 WE#-1 RE#-1 DQ[7:0]-1 N/A WP#-1 CE2# CLE-2 ALE-2 WE#-2 RE#-2 DQ[7:0]-2 N/A WP#-2 Sync CE# CLE ALE CLK W/R# DQ[7:0] DQS WP# CE2# CLE-2 ALE-2 Package Target 1 LUN 1 Target 2 LUN 1 CLK-2 W/R#-2 WP#-2 DQ[7:0]-2 DQS-2 a R/B# a R/B2# 产品种类： NOR闪存 □ 安装风格： SMD/SMT □ 封装/箱体： BGA-64 □ 系列: M29EW □ 存储容量： 1 Gbit □ 电源电压最小： 2.7 V □ 电源电压最大： 3.6 V □ 有源读取电流（最大值）：