RoHS对废弃电子电器产品的环保要求.pptVIP

* Darryl Yun * * Darryl Yun * * Darryl Yun * Replacement-Example 替代物质-例子 Lead free solder 无铅焊锡 At present most of solders is the tin-lead alloy as：63% tin / 37%lead (187 °C) 最常用的焊料是铅锡合金（63%锡，37%铅）(187 °C) Main replacement: SnAgCu (Ag 3.3-4.3%, Cu 0.4-1.1%) 锡、银、铜作为主要替代物 (银3.3-4.3%, 铜 0.4 – 1.1%) LF218TM 96.5 Sn /3.0 Ag /0.5Cu (217-218)* recommended by JEIDA patented.(为JEIDA专利推荐) 96 Sn / 3.5 Ag / 0.5 Cu (217-218)* no patented(未获专利) CASTIN? 96.2 Sn / 2.5 Ag / 0.8 Cu / 0.5 Sb (217)* patented(已获专利) *=melting point in °C 熔点为 °C Replacement-Example 替代物质-例子 Alloy Cost Per Kg (US Dollar) 63Sn / 37Pb 6.36 96.5 Sn /3.0 Ag /0.5Cu 9.33 96 Sn / 3.5 Ag / 0.5 Cu 10.44 96.2 Sn / 2.5 Ag / 0.8 Cu / 0.5 Sb 8.59 Lead free soldering cost comparison 无铅焊锡合金价格比较 Japan companies leading in lead free soldering 日本无铅焊锡进展和计划 Replacement-Example 替代物质-例子 Replacement-Example 替代物质-例子 Cadmium free Contact point 无镉连接点 At present, the materials for contact point are 目前的替代品: AgCdO or AgCdSe or AgCdO + Cu And the main replacement is 主要的替代品: AgSnO or AgZnO Replacement-Example 替代物质-例子 Alternative brominated flame retardants (BFR) 可以使用的溴化阻燃剂 - Oligomeric brominated flame retardants 低聚溴化阻燃剂- Tetrabromobisphenol – A (TBBPA) mainly used for PCB board 四溴二苯酚 – A (TBBPA)， 主要用于印刷电路板- Ethylene 1,2 bis(tetrabromophthalimide) – (EBTBP) 乙烯1,2 二(四溴苯邻二甲酰亚胺) – (EBTBP)- Ethane 1,2 bis(pentabromophenyl) – (EBP) 乙烷1,2 二(五溴联苯) – (EBP) Replacement-Example 替代物质-例子 4. Replacement of Mercury 汞的替代品 tilt switches, reed-relays, thermostats. contact point material (e.g. relays) - replacement available跌倒开关，干簧继电器，温控器触点材料 (如继电器上使用的) - 可使用替代物 Replacement-Example 替代物质-例子 4. Replacement of Cr(6+) 六价铬的替代品 DACROMET technology ，invented by US, but Japanese buy the patent. This material has a good anti-corrosion performance, and no Cr(6+) 达克罗技术，美国发明,日本买下了专利。有良好的耐腐蚀性，无六价铬。 Test me