SMT组装流程介绍.pptVIP

SMT組裝流程介紹 1.電路板組裝流程 2. SMTDIP元件規格 3. SMT組裝及PCBA測試要求 4. REFLOW Profile (Alloy Sn63 Pb37) : For BGA chipset 5. AOI 光學檢查要求 6. SMD作業不良實例探討 Prepared by: AEE / Acher 2002.10.03 Component Types Plastic BGA Micro BGA/ CSP Flip Chip Ceramic BGA Super BGA Tab BGA PCB SMD DIP 1-1.PCBA(電路板組裝,#1)—Single ReflowDip Process EX: M.B. of DeskTop-PC 1.電路板組裝流程 PCBA(電路板組裝,#1)—Single ReflowDip Process EX: M.B. of DeskTop-PC 入庫 錫膏印刷 貼片機 迴焊爐 ICT 手插件 迴焊爐 Touch-Up TestPack 1-2.PCBA(電路板組裝,#2)—Double ReflowDip Process EX: M.B. of Mobile-PC PCB SMD DIP 入庫 錫膏印刷(1) 貼片機 迴焊爐 ICT 手插