SMT应用方案分析.pptVIP

* * * Internal Use Copyright ? MediaTek Inc. All rights reserved. Internal Use MT6253(aQFN) SMT Application Introduction 2010/01 Prepared by: Zhong Xin Approved by: Rio Chiang E-mail: customer_service@ 内容 MT6253介绍 What is aQFN aQFN’s Advantage vs TFBGA QFN 客户量产问题集 解决方法：PCB设计 解决方法：钢网设计 MT6253 (aQFN) Task Force Team Appendix 1 MT6253介绍 Mediatek将于2009年 Q4推出首款GSM/GPRS单芯片方案MT6253 MT6253集成了数字基频(DBB)，模拟基频(ABB)，电源管理(PM)，射频收发器(RF)。支持手机相机，高速USB，及D类音频功放 MT6253=MT6225+MT6318+MT6139 MT6253采用了新一代封装技术(aQFN) MT6253N 0930- BFAL DSPK54-04-1G2-52 MT6253正印 2 What is aQFN aQFN means Advanced QFN Features Low Cost, Profile, and Light weight Excellent Thermal / Electrical Performance Excellent Anti-drop--twist capability High I/O count up to 400 Leadless multi-row package Free-form I/O design Power / Ground ring Fine lead pitch 0.4mm GND aQFN QFN TFBGA 0.6-0.85 0.85-1 1-1.2 PKG height (mm) 3 BT-RESIN PAD (Cu) Solder Ball (SAC305) Solder Mask IMC layer, Au/Ni/SAC305 aQFN TFBGA aQFN’s Advantages vs TFBGA QFN Package Structure aQFN (MT6253) TFBGA (MT6225 MT6318) QFN (MT6139) Cost Medium High Low Thermal Excellent Medium Excellent Electrical Excellent (Lead-frame) Medium (Substrate) Excellent Anti-drop-- twist Excellent Medium Excellent PKG profile Low High Medium Wire bond-ability Good Good Medium 0.4mm Pitch Yes Yes Yes SMT ability Medium (Few experience) Good (Solder ball) Good (Single-row) Rework Method 1.Pre-solder (Fresh) 2.Good SOP Good Yield Re-ball (Mature) Solder Iron (Mature) 4 + 客户量产问题集 5 截至3/12，18客户已经MP, 共生产802K. 平均良率99.3% PCB Layout suggestion for E-pad area: 推荐与IC接地焊盘相同尺寸 (即封装库1：1的面积比例)制作E-Pad. PCB Layout suggestion for Signal Pad： 推荐制作直径为0.27mm的圆形焊盘(按封装库1:1制作)，精度控制在+/-0.02mm 禁止在PCB表层使用铺铜设计. 为保证接地性能，RF GND间建议做成网格状走线或将GND Pad连通到内层的GND平面. 表层走线线宽尽量控制在0.2mm以内。 Pad与Pad之间留有阻焊桥. 解决方法:PCB设计 √ X E-Pad 表层不铺铜 表层铺铜 6 Stencil Opening suggestion for E-pad area: 推荐钢网开口面积为PCB E-Pad面积的30%～40%. 推荐钢网开口边缘距离PCB 焊盘边缘0.2mm以上. 建议将钢网开口区域分割成为边长小于2mm的大小相